amc
Fully automatic single-wafer processing

With its amc series amcoss offers fully automatic single wafer processing equipment for coating, developing, cleaning, heating/cooling, and lift-off of wafers and other substrates. Every customer individually sets up their equipment according to their requirements as far as throughput and desired processing options are concerned.

Fully automatic amc wafer processing equipment

Customer specific processes fit for future

Especially in microsystems technology the requirements to production processes and product quality, as well as cost pressure in wafer processing are high. That´s where amcoss with its wafer processing equipment comes in: we focus on our customers´ needs and on attractive cost-performance calculation. Therefore, every tool may be optimized either for flexible single processes or high throughput. Besides, ams pilot software independently controls processes in every equipment and therefore supports the operator and optimizes all processes. So, with our equipment you will receive solutions for substrate coating, developing, cleaning, heating/cooling and lift-off, that contribute to reaching your goals.

Amcoss amc Fully Automatic Wafer Processing

Choosing the appropriate production equipment is a highly influential aspect of sustainability for a company and their products. With the acquisition of an amcoss equipment you not only opt for an intelligent technical solution, but for more efficiency in various respects.

Process efficiency

Almost all features of our amc tools, e.g. linear motor drive for nozzle positioning or our special EBR solutions have been configured to enable and optimize flexible processes. ams pilot software with its precise system control also highly contributes to that fact. So, throughput, as well as quality of the finished product increase, reject diminishes, downtime and prevention costs go down and time is being saved.

Cost efficiency

Optimized processes, attractive purchasing costs, a very good return on investment, low maintenance and spare parts costs, and longevity of all components, contribute to raising cost efficiency. Moreover, flexible process options and the great variety of processable substrates help to increase machine efficiency and reduce time for retrofits. Furthermore, the compact footprints of our amc equipment, as well as the option of a genuine through-the-wall installation save expensive cleanroom capacity.

Protection of ressources and energy efficiency

Environmental protection is getting increasingly important in all aspects of life and it is also a heartfelt matter for amcoss, reflecting in our equipment. Thanks to the energy save mode of our ams pilot software and the unique amcoss dispense system, an option for media re-use and the recycling of dissolved metals in the lift-off process, as well as other clever features, not only resists and media, but also energy can be saved. Consequently, there is less reject and waste. Because various processes can be run within one compact machine, its ecological footprint is generally smaller. At last, we try to keep our supply chain regional wherever possible.

Ergonomics and safety

Sustainability may not only be limited to technology, but has also to focus on humans. Production equipment has to be simple, comfortable and safe in operation. Our singular amc operation concept shows in all aspects of our amcoss equipment – in our user-friendly ams pilot software and a machine design enabling easy access to the modules, which can be effortlessly installed or removed, as well as in easy process adjustment. Moreover, many integrated features increase operator safety.

Machine types

Modular, flexible, individual – amc machine series

All 3 amc models have been designed as adaptable platforms, so that individual configurations, process solutions and combinations are standard with amcoss. The footprints, however, are very compact and room saving. With, e.g. amc 1000+ you will find 3 processes, 1 wafer-handling-station and up to 4 I/O stations on about 1 m² and you may flexibly process wafer sizes between 2“ and 8“.

amc 1000+ — minimum machine space – optimally used

amc1000+

Flexible machine configuration and processing of different wafer sizes:

  • Wafer diameters: 2“ to 8“
  • Up to 4 I/O stations for 2“ to 6“ (max. 4x open carriers or 2x SMIF) or
  • Up to 2 I/O stations for 8“ (open carriers or SMIF)
  • Max. 3 individually selectable process modules
  • 1 two-link wafer handler
  • Outer dimension L x W: 1140 mm x 1215 mm
amcoss amc1000+ footprint 4 IO
amcoss amc1000+ footprint 2 IO

amc 2000+ — five processes on just about 2 m²

amc2000+

Highly flexible machine configuration and processing of different wafer sizes:

  • Wafer diameters: 2“ to 8“
  • Up to 4 I/O stations for substrates 2“ to 8“ (max. 4x open carriers or 2x SMIF) or
  • Max. 5 individually selectable process modules
  • 1 two-link wafer handler
  • Outer dimension L x W: 1595 mm x 1360 mm
amcoss amc2000+ footprint 4 cleaner modules
amcoss amc2000+ 3 process modules 2 hotplate stacks

amc 2500+ — compact service package for high throughput

amc 2500+

  • Wafer diameter: 2“ bis 8“
  • According to configuration of wafer handling up to 4 I/O-stations (max. 4 x open carriers or 3 x SMIF)
  • Max. 7 individually selectable process modules
  • 2 two-link wafer handlers or
  • 1 two-link wafer handler on linear track
  • Outer dimension: L x W: 2156 mm x 1502 mm
amcoss amc2500+ footprint 2 robot handler
amcoss amc2500+ footprint 1 robot handler

Highlights

Added value through perfected technical details

Substrate Variety amcoss amc Wafer Processing

Substrate variety

Substrate variety

Every amc equipment is a genuine Bridgetool, which means that different substrate sizes may be processed simultaneously. When changing wafer size, no technical adjustments and retrofits are necessary. So, utmost flexibility is guaranteed. With the help of laser sensors our intelligent carrier scanner identifies substrate size, carrier type, substrate bow and thickness, mixed or double loaded slots and wafer protrusion.

Substrate range

Thin
80 µm 6“, bow concave / convex
150 µm 8“, bow concave / convex

Thick
15 mm 6“, weight 0,75 kg

Shape
round 2” – 12”
square, rectangular, up to 8” x 8”

Materials
Si, SiC, GaN, GaAs, sapphire, glass, etc.

Through-the-Wall Installation amcoss amc Wafer Processing

Genuine Through-the-wall installation

Genuine Through-the-wall installation

Because the process chamber has been realized as a HTU with particle filter, which ensures a fully climatized process atmosphere (temperature, humidity) a genuine through-the-wall installation with all its advantages is possible.

einfacher Zugang amcoss amc Waferbearbeitung_2

Easy access to all components

Easy access to all components

All doors and the windows on the sides and the back of the equipment can be easily removed and put aside space-savingly. Especially the frameless side windows are very lightweight. So, comfortable access to all modules and controls during machine conversion and maintenance is guaranteed.

Unique Machine Design amcoss amc Wafer Processing

Unique machine design

Unique machine design

During development of the classy design by an industrial designer our focus was not only on modern appearance, but especially on user-friendliness, functionality and ergonomics: the large windows allow good insight and access to the machine, all operating elements are in favourable positions and both integrated LED status lights can be seen well from any direction. The anthrazite coloured surface coating is on the one hand insensitive towards chemical cleaning agents and on the other hand absorbs the amber light in the cleanroom which is relaxing on the eye.

Control Components amcoss amc Wafer Processing

Reduction of controls

Reduction of controls

Due to intelligent designs, advantageous machine layout, and the use of standardized industrial components, the number of control parts as well as other components could be substantially reduced. As a result, error rate decreases, material costs can be saved, service is being facilitated, and costs as well as labor input are reduced in general.

Conversion Mechanism amcoss amc Wafer Processing

Flexible machine adjustments

Flexible machine adjustments

Its modular setup and adaptable software ensure that the amc equipment can be easily adjusted or extended directly at the customers’ site. Also, the installation of another process module can be simply realized by means of an integrated conversion mechanism. Hot- and coolplates may be added. So, whenever their process requirements change, our customers can be offered uncomplicated solutions.

Easy Maintenance amcoss amc Wafer Processing

Easy maintenance

Easy maintenance

The whole electronic system can be easily accessed at the back of machine. It has been placed above the media system and is therefore totally separated from it. Use of long-living, proven standard components, easy installation and removal of bowls as well as hotplates, and many other of the already mentioned highlights make maintenance simpler and reduce its requirements, as well as machine downtime. In addition, the whole system is being supported by the comfortable service functions of ams pilot software.

Operating Concept amcoss amc Wafer Processing

Unique operating concept

Unique operating concept

ams pilot control software as well as the overall equipment layout have been designed to offer best possible user-friendliness, ergonomics and comfortable handling. Our modern software can be intuitively operated and supports even unexperienced users. Furthermore, operating- and service personnel will be able to comfortably and safely handle all machine units.

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