amr & amt Semi-automatic single wafer processing
semi-automatic amr single wafer processing equipment
Free choice for profitable small batch series
Our amcoss amr series for coating, developing, cleaning, lift-off, vapor priming, etching and heating of individual substrates is a completely modular system and perfectly adapted to the requirements of single- and small batch series production. The control unit, consisting of the control system with the ams PILOT software, may be flexibly combined according to customer needs and specific process requirements, with one or more selected processing units. Every unit holds one processing module (coater, developer, cleaner, lift-off, etcher, hot-/coolplate, vapor priming hotplate or media module). Therefore, our customers can individually compose their personal amr equipment. Depending on the wafer diameters that will have to be processed, the units will be fitted with different processing modules of varying sizes. As a consequence there are two amr types varying in size with, however, the same dimensions:
amr 200 – for wafer types 2“ to 200 mm in diameter, as well as Small Pieces
amr 300 – for wafer types 2“ to 300 mm in diameter, as well as Small Pieces
Possible configurations
amr processing units –
proven quality requiring minimum space
Naturally, all amr units contain the same proven processing modules as used in our amc equipment with all their sophisticated features. The only difference is wafer handling, which in contrast to our amc series does not run automatically in the amr tools. This means that the operator has to put/remove the substrates manually into/from the process modules. Processes themselves, however, will run fully automatic as usual and will be controlled and monitored by our intelligent ams PILOT software. Existing recipes may be taken from/to amcoss amc equipment.
All processing units do have the same compact and space-saving measurements (except for the control unit, which is even smaller). So, the room required can be planned easily which saves expensive production or laboratory space.
amr control unit
Control system with ams PILOT software for control and easy operability of all processing units connected.
Standard unit
- Outer dimensions L x W: 600 x 450 mm
- 12” colour-touchscreen with IPC
- Carrier placement area for easy loading and unloading of substrates
- Comfortable access to components inside the housing
- Recipes can be transferred from or into amcoss amc equipment
Extra-slim control unit
- Outer dimensions L x W: 600 x 200 mm
- Exceptionally slim for minimum space requirements
- 12” touch screen on moveable arm
- One process module can be connected and controlled
amr processing units
Coater unit
- Outer dimensions L x W: 600 x 600 mm
- Positive- & negative-coating
- SU8 coating
- PMMA coating
- Spray coating
- Thick-resist coating
Developer unit
- Outer dimensions L x W: 600 x 600 mm
- Puddle developing
- Spray developing,
- Developing with TMAH, KOH & solvents
Lift-off/etching unit
- Outer dimensions L x W: 600 x 600 mm
- Standard metal-lift-off with NMP, DMSO
- Resource-saving metal-lift-off with DMSO Megasonic
- Solvent strip
- FEOL etching
- BEOL etching
- Metal etching
Cleaner unit
- Outer dimensions L x W: 600 x 600 mm
- Post CMP cleaning
- RCA cleaning
- Frontside, backside and edge bevel cleaning
- TSV cleaning
Heater unit
- Outer dimensions L x W: 600 x 600 mm
- Optional cover heating
- Distance control to hotplate surface via fixed proximity, programmable proximity, vacuum contact
amr media unit
- Outer dimensions L x W: 600 x 600 mm
- Integrated drawer
- Integrated exhaust connection
- Security drip pan with leakage sensor
- System supply with different media
Sustainability in every piece
Sustainable production and company management are not only limited to large-scale production businesses – on the contrary: many times, companies processing small lots very often are facing individual and complex requirements in their production and do have to operate economically sustainable. These needs are fulfilled by our amr series, so that in terms of costs, technical possibilities, and room consumption you don´t have to crack a nut with a sledgehammer. Of course, you will receive the same proven quality, intelligent technologies, as well as environmentally protective and ergonomic aspects with your equipment.
Reasonable costs
Flexible process adaptations
Modern man-machine interface
amr highlights –
sophisticated details make up an ideal system
Reduction of controls
Reduction of controls
Due to intelligent designs, advantageous machine layout, and the use of standardized industrial components, the great number and variety of control parts as well as other components could be substantially reduced. As a result, error rate decreases, material costs can be saved, service is being facilitated, and costs, as well as labor input are reduced in general.
Central process control
Central process control
A central control unit monitors all connected processing units via the respective software module of our comfortable amcoss ams PILOT software. The number of processing units may be extended at any time. All necessary parameters can be adjusted and are logged in the software. All the main control components are easily accessible and tightly arranged in one spot within the control unit and are therefore completely separated from resists, media and solvents.
Elaborate operating concept
Elaborate operating concept
ams PILOT control software, as well as the setup of the equipment in general have been designed to offer best possible user-friendliness, ergonomics and comfortable handling. Even though the processing areas are completely housed-in, the frameless protective windows can be slid upwards to give comfortable access to the bowls. For operation you may also move unhindered between processing units, because you are not being obstructed by disturbing swinging doors. All of that helps to save room capacity. Furthermore, the processing modules as well as the touch screen are mounted in comfortable working height. Our modern software can be intuitively operated and supports even unexperienced users. The tool can be equipped with a SECS/GEM interface or other customized protocols.
Unique equipment design
Unique equipment design
During development of the classy design by an industrial designer our focus was not only on modern appearance, but especially on user-friendliness, functionality, and ergonomics: the large sliding doors allow good insight and access to the processing modules, all operating elements are in favourable positions and both integrated LED status lights can be seen well from any direction. The anthrazite coloured surface coating is on the one hand insensitive towards chemical cleaning agents and on the other hand absorbs the amber light in the cleanroom which is relaxing to the eye.
Flexible machine adjustments
Flexible machine adjustments
Its modular setup and adaptable software ensure that the amr equipment can be easily extended with new machine units directly at our customers’ site. Moreover, retrofitting or exchange of process bowls, extension of resist- or media piping or even the installation of an additional FFU can be realized without problems. So, whenever their process requirements change, our customers can be offered uncomplicated solutions.
Easy maintenance
Easy maintenance
Use of long-living, proven standard components, easy installation and removal of bowls and many other of the already mentioned highlights make maintenance simpler and reduce its requirements as well as machine downtime. In addition the whole system is being supported by the comfortable service functions of ams PILOT software.
AMT TABLE-TOP HOTPLATE
Flexible and compact for small quantities in the temperature range from 30 – 300 °C
Due to its semi-automatic handling the compact, stand-alone amcoss amt laboratory-hotplate is suitable for small-lot production or for single process steps within the thermal treatment of wafers up to 200 °C (and 300 °C respectively) in laboratories. Both available models cover a wide range of substrate sizes between 2” up to 200 mm (amt 200) and or rather 300 mm (amt 300), as well as special substrate specifications (square, rectangular, etc.). Flexibly selectable configuration possibilities turn each amt hotplate into a custom-made device that fits exactly to the individual process requirements.
The usage of high-quality, standard industry-components ensures reliability in operation, long lifetime, good serviceability, and a very attractive price-performance-ratio.
amt 200 – for wafers and substrates from 2“ up to 200 mm
- For wafer sizes up to 200 mm
- Standard temperature range: 30 – 200 °C
(with high-temperature hotplate: up to 250 °C or 300 °C) - Housing stainless steel, hotplate aluminium anodized
- Single zone heater with temperature sensors
- Overtemperature sensor with safety switch
- Adjustable to +/- 0.1 K
- Uniformity +/- 0.5 K ≤ 100 °C, +/- 1 % > 100 °C measured on a 200 mm wafer
- Cover with manually adjustable exhaust connector
- Table-top version
- PLC controller for 99 recipes
- Programmable time and hotplate temperature
- Documentation in English language
- Dimensions approx. 370 x 520 x 300mm (w x d x h with “closed cover”)
- Supply voltage 230 V, 50 Hz
- CE-certified
amt 300 – for wafers and substrates from 2“ up to 300 mm
- For wafer sizes up to 300 mm
- Standard temperature range: 30 – 200 °C
(with high-temperature hotplate: up to 250 °C or 300 °C) - Housing stainless steel, hotplate aluminium anodized
- Single zone heater with temperature sensors
- Overtemperature sensor with safety switch
- Adjustable to +/- 0.1 K
- Uniformity +/- 0.5 K ≤ 100 °C, +/- 1 % > 100 °C measured on a 200 mm wafer
- Cover with manually adjustable exhaust connector
- Table-top version
- PLC controller for 99 recipes
- Programmable time and hotplate temperature
- Documentation in English language
- Dimensions approx. 370 x 520 x 300mm (w x d x h with “closed cover”)
- Supply voltage 230 V, 50 Hz
- CE-certified
amt Highlights –
numerous standard and additional features
meeting different requirements
Optional lift pins
Optional lift pins
Optionally, the hotplate can be equipped with 3 lift pins which hoist the wafer by pushing it at the backside. This simplifies removal of the substrate.
Various versions of lift pins are available:
- Pneumatic lift pins for different wafer sizes
- Programmable, electrical lift pins for different wafer sizes – lifting height and time programmable via recipe
99 recipes
99 recipes
99 standard program recipes can be selected and adjusted directly on the integrated touch screen (PLC controller). Processing time and nominal hotplate temperature are programmable.
Efficient exhaust
Efficient exhaust
Efficient exhaust which can be adjusted manually without difficulty.
Proximity
Proximity
As standard, the substrate lies in full contact, but slackly on the hotplate. Additionally, following options are selectable:
- Vacuum chuck: full contact of substrate to the hotplate with vacuum chucking
- Proximity balls: fixed proximity of substrate to the hotplate surface is 150µ
- Customized proximity: each individual substrate proximity is selectable via programmable electrical lift pins
N2 gas-purge
N2 gas-purge
If an inert gas atmosphere is needed for special processes the N2 gas-purge option (gas valve) is available. Time and duration of the purge are programmable via the recipe. The flow rate can be adjusted with the aid of the needle valve.
Temperature control
Process temperature on display
The process temperature is shown on the display and can be monitored at any time of the heating process. The maximum temperature is 200 °C as standard, but can be raised up to either 250 °C or 300 °C with an optional high-temperature hotplate.
